The 2016 IEEE International Symposium on Radio-Frequency Integration
Technology (RFIT2016) will be held at the Howard International House,
Taipei, Taiwan, on August 24-26, 2016. This conference is organized and
sponsored by the IEEE MTT-S, and will be supported by IEEE MTT-S Taipei Chapter.
The Taiwan Electromagnetic Industry-Academia Consortium (TEMIAC) is a Technical
Co-Sponsor of RFIT2016.
Manuscript submission opened, to submit your paper, please click
Manuscript submission deadline:
1 April 2016 15 April 2016
Notification of Acceptance: 13 May 2016
Submission of final manuscript and author registration: 10 June 2016
The topics include, but are not limited to,
the following technical areas:
High-number Spec ICs: high
speed/high frequency/high bandwidth/high
integration/high performance circuits and
Low-number Spec ICs: low
power/low voltage/low noise/low complexity
circuits and systems.
Device Technologies: CMOS,
SOI, SiGe, GaAs, LDMOS, GaN, reliability,
characterization, CAD, modeling, EM
simulation, co-simulation, etc.
Packaging technology: MCM,
SiP, TSV, MEMS, flip chip assembly, wire
bonding, anisotropic conductive film, etc.
Passive Circuits and Antenna:
on-chip antenna, integrated passive devices,
ferrite, piezoelectric material, etc.
Frequency Generation ICs:
VCOs, PLLs, synthesizers, ADPLL, frequency
dividers, multipliers, etc.
Building Block RFICs: LNA,
PA, mixers, RF front-end, Si-based MMIC,
Analog and Mixed Signal ICs:
amplifiers, ADC, DAC, comparators, filters,
RF Sensor ICs: automotive
radar, security, wearable devices,
biomedical and healthcare applications, etc.
Power Transmission: RFIDs,
electric coupling, electromagnetic
induction, magnetic resonance, wireless
power transmission, etc.
Emerging ICs: power
management, digital RF
circuits/architectures, RF BIST, data
converters, reconfigurable and tunable ICs,
new energy vehicle electronics EM and ICs,